The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[21a-331-1~12] 13.7 Compound and power electron devices and process technology

Fri. Sep 21, 2018 9:00 AM - 12:15 PM 331 (International Conference Room)

Tetsuo Narita(Toyota Central R&D Labs., Inc.)

11:30 AM - 11:45 AM

[21a-331-10] Fabrication of enhancement-mode AlGaN/GaN HEMTs using an AlGaN regrown layer

〇(M2)Keito Kanatani1, Akio Yamamoto1, Masaaki Kuzuhara1 (1.Univ. of Fukui)

Keywords:GaN, Vertical HEMT, Normally-off

The fabrication of vertical AlGaN/GaN HEMT, as an alternative of vertical GaN-based MIS-FET having problems such as low mobility and large hysteresis, were investigated. Based on the evaluation of AlGaN/GaN hetero-structures prepared with AlGaN regrowth on RIE-GaN surfaces, the fabrication processes of the vertical device were optimized. As a result of that, a device with a drain current higher than 0.15 A/mm and normally-off operation was realized.