Keita Ichikawa

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Speaker, Author, Co-Author

Tue. Mar 20, 2018 9:15 AM - 12:15 PM C101 (52-101)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20a-C101-1~11] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

9:30 AM - 9:45 AM

[20a-C101-2] Study for Developing Metallization Method Using Electrically Induced Bubble and Plasma

〇Keita Ichikawa¹, Yudai Fukuyama², Shingo Maeda¹, Yoko Yamanishi² (1.Sibaura Inst., 2.Kyushu Univ.)