The 65h JSAP Spring Meeting, 2018

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[17p-P12-1~27] 13.7 Compound and power electron devices and process technology

Sat. Mar 17, 2018 4:00 PM - 6:00 PM P12 (P)

4:00 PM - 6:00 PM

[17p-P12-19] Characterization of traps in He-implanted n-GaN

Ken Iyoda1, Yutaka Tokuda1, Kenji Shiojima2, Joji Ito3, Takahide Yagi3 (1.Aichi Inst. of Tech, 2.Fukui Univ., 3.SHI-ATEX Co, Ltd.)

Keywords:semiconductor, ion-implanted n-GaN, Deep Level Transient Spectroscopy / Minority Carrier Transient Spectroscopy

We have characterized traps introduced in MOCVD n-GaN by He ion implantation with DLTS and MCTS. Comparison was made between He and H iom implantation. DLTS signals increase due to the generation of defects by ion implantation. A broad peak labeled E0 is observed in addition to the gradual increase of DLTS signals above 200 K, which is relatively important in He ion implantation. This suggests the higher production of deeper levels by He ion implantation. A comparative study of annealing behavior of defects will be between He and H ion implantation.