[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17p-P7-2] Completely compressively strained SiGe thin film formation technique using Sputter Epitaxy Method

〇(M1)Yosuke Aoyagi¹, Akira Motohashi¹, Kyohei Degura¹, Katsumi Okubo¹, Nobumitsu Hirose², Akifumi Kasamatsu², Toshiaki Matsui², Takahiro Tsukamoto¹, Yoshiyuki Suda¹ (1.Tokyo Univ. of Agric. & technol., 2.National Inst. of Inf. and Commun. Technol.)

Keywords:semiconductor