[17p-P7-1~21] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

▼ [17p-P7-4] Enhanced Mechanical Strength of Ti-Au Bi-Layered Micro-Cantilever For MEMS Accelerometers

〇Ken Hashigata¹, Haochun Tang¹, Chun-Yi Chen¹, Tso-Fu Mark Chang¹, Daisuke Yamane¹, Katsuyuki Machida^1,2, Kazuya Masu¹, Masato Sone¹ (1.Tokyo Tech, 2.NTT AT Corp.)

Keywords:micro-cantilever, Ti-Au, Bi-layer