The 65h JSAP Spring Meeting, 2018

Presentation information

Poster presentation

13 Semiconductors » 13.5 Semiconductor devices and related technologies

[17p-P8-1~24] 13.5 Semiconductor devices and related technologies

Sat. Mar 17, 2018 1:30 PM - 3:30 PM P8 (P)

1:30 PM - 3:30 PM

[17p-P8-16] Study of stacked type logic LSI with fabrication technology of 3D NAND flash memory.

Fumiya Suzuki1, Shigeyoshi Watanabe1 (1.Shonan Inst. of Tech)

Keywords:LSI, 3D NAND Flash memory, Logic circuit

Study of stacked type logic LSI with fabrication technology of 3D NAND flash memory has been described.Stacked type NAND/NAND logic for speed and low power operation has been presented. By using vertical connection method by the low-resistance poly-silicon manufacturing process and variable trench depth realization process high speed operation can be succesfully realized without sacrificing low fabrication cost.