The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

15 Crystal Engineering » 15.6 Group IV Compound Semiconductors (SiC)

[19a-D103-1~12] 15.6 Group IV Compound Semiconductors (SiC)

Mon. Mar 19, 2018 9:00 AM - 12:15 PM D103 (56-103)

Toshinori Taishi(Shinshu Univ.)

12:00 PM - 12:15 PM

[19a-D103-12] A study of the CVD growth condition for filling 50-μm 4H-SiC deep trench

Shiyang Ji1, Ryoji Kosugi1, Kazutoshi Kojima1, Kohei Adachi1,2, Yasuyuki Kawada1,3, Kazuhiro Mochizuki1,4, Akiyo Nagata1, Yasuko Matsukawa1, Yoshiyuki Yonezawa1, Sadafumi Yoshida1, Hajime Okumura1 (1.AIST, 2.Mitsubishi Electric, 3.Fuji Electric, 4.Hitachi Ltd.)

Keywords:trench filling, silicon carbide, CVD

Different with the shallow trench filling, there have some new problems in filling 50-um 4H-SiC deep trench, which were addressed and studied in this work. Then, the revision of CVD growth condition was proposed. Finally, the complete fill of the deepest 4H-SiC trench to now, was achieved.