The 65h JSAP Spring Meeting, 2018

Presentation information

Oral presentation

8 Plasma Electronics » 8.2 Plasma deposition of thin film, plasma etching and surface treatment

[20a-C204-1~12] 8.2 Plasma deposition of thin film, plasma etching and surface treatment

Tue. Mar 20, 2018 9:00 AM - 12:15 PM C204 (52-204)

Masanori Shinohara(Natl. Inst. of Tech.,Sasebo Col.)

9:30 AM - 9:45 AM

[20a-C204-3] Formation of C-Axis-Oriented Aluminum Nitride Thin Films with Plasma Enhanced Reactive Pulsed DC Magnetron Sputtering

Kosuke Takenaka1, Tomoki Yoshitani1, Giichiro Uchida1, Yuichi Setsuhara1 (1.Osaka Univ.)

Keywords:Aluminum Nitride, Sputtering