Rui Liang

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Speaker, Author, Co-Author

Thu. Sep 19, 2019 9:00 AM - 12:00 PM E304 (E304)

Oral presentation
| 13 Semiconductors
| 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[19a-E304-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

11:30 AM - 11:45 AM

▼ [19a-E304-11] Annealing Effect on Room-Temperature-Deposited SiO₂Liner for Multichip-to-Wafer 3D Integration Process

〇(M2C)Rui Liang¹, Sungho Lee¹, Yuki Miwa¹, Kousei Kumahara¹, Hisashi Kino³, Takafumi Fukushima², Tetsu Tanaka^1,2 (1.BME of Tohoku Univ., 2.ME of Tohoku Univ., 3.FIRS of Tohoku Univ.)