Keigo Komaru

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Speaker, Author, Co-Author

Fri. Sep 20, 2019 1:45 PM - 4:30 PM E319 (E319)

Oral presentation
| Code-sharing session
| 【CS.6】 Code-sharing Session of 6.5 & 7.6

[20p-E319-1~10] 【CS.6】 Code-sharing Session of 6.5 & 7.6

4:15 PM - 4:30 PM

[20p-E319-10] Device temperature characteristics in directly-bonded surface-mounted LED package

〇(M1)Keigo Komaru¹, Jianbo Liang¹, Yoshitaka Nishio², Naoteru Shigekawa¹ (1.Osaka City Univ, 2.Toyo Aluminium K.K.)