The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[18p-N302-1~18] 13.7 Compound and power electron devices and process technology

Wed. Sep 18, 2019 1:00 PM - 6:00 PM N302 (N302)

Masashi Kato(Nagoya Inst. of Tech.), Taketomo Sato(Hokkaido Univ.)

5:30 PM - 5:45 PM

[18p-N302-17] Current status of evaluation for Radio-Frequency performance in 2DHG Diamond MOSFETs; Output Power Density Pout = 3.8 W/mm at 1 GHz

〇(M1)Ken Kudara1, Shoichiro Imanishi1, Kiyotaka Horikawa1, Atsushi Hiraiwa1, Hiroshi Kawarada1,2 (1.Waseda Univ., 2.Waseda ZAIKEN)

Keywords:diamond, Radio frequency, FET

Radio-Frequency (RF) output power of transistor is improved by applying high voltage. We have reported high breakdown voltage diamond FETs exceeding 1500V with 200 nm atomic-layer-deposition (ALD)-Al2O3 film. In this work, RF devices are applied based on this high breakdown voltage structure. 2DHG diamond MOSFETs with 100 and 200 nm Al2O3 were fabricated on II-a polycrystalline diamond substrate which has high crystallinity, (110) preferential orientation and grain size of approximately 300 μm. At 100 nm thick Al2O3 diamond MOSFETs, the maximum Pout of 3.8 W/mm was obtained at high VDS = −50 V. It is the highest value in diamond FETs. At 200 nm thick Al2O3 diamond MOSFET, the Pout of 2.5 W/mm and maximum power gain of 8.0 dB were obtained at VGS = 16 V andVDS = −70 V for LGD = 4.5 μm. The large-signal RF performance was evaluated at VDS = −70 V for the first time in diamond. We propose diamond as a promising material for radio frequency and high power devices next to GaN.