The 80th JSAP Autumn Meeting 2019

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[19a-E304-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Thu. Sep 19, 2019 9:00 AM - 12:00 PM E304 (E304)

Reo Kometani(Univ. of Tokyo), Fukushima Takafumi(Tohoku University)

11:45 AM - 12:00 PM

[19a-E304-12] Microbump Bonding Technology for Multichip-to-Wafer 3D Integration

Kousei Kumahara1, Miwa Yuki1, Lee Sungho2, Liang Rui1, Kino Hisashi3, Fukushima Takafumi1,2, Tanaka Tetsu1,2 (1.Grad. sch. of biomedical eng., Tohoku Univ., 2.Grad. sch. of eng., Tohoku Univ., 3.FRIS, Tohoku Univ.)

Keywords:Multichip-to-Wafer, 3D Integration, Microbump