[19a-E304-1~12] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

△ [19a-E304-12] Microbump Bonding Technology for Multichip-to-Wafer 3D Integration

〇Kousei Kumahara¹, Miwa Yuki¹, Lee Sungho², Liang Rui¹, Kino Hisashi³, Fukushima Takafumi^1,2, Tanaka Tetsu^1,2 (1.Grad. sch. of biomedical eng., Tohoku Univ., 2.Grad. sch. of eng., Tohoku Univ., 3.FRIS, Tohoku Univ.)

Keywords:Multichip-to-Wafer, 3D Integration, Microbump