10:15 AM - 10:30 AM
▲ [19a-E304-6] Strengthening of Gold-Based Micro-Structures by Alloying and Incorporation of Oxide Nanoparticles
Keywords:Yield strength, Au-Cu alloy, Au-TiO2 composite
Gold is applied in MEMS because of the high electrical conductivity, chemical stability, and the mass density. Especially for the high mass density, proof mass in MEMS accelerometers made of gold are showing high sensitivity because of the lowered Brownian noise achieved by increasing overall weight of the proof mass. Enhancing the mechanical strength is also a research interest to ensure high structure stability of movable components in MEMS devices.
In electrodeposition of metals, alloying and incorporation of oxide nanoparticles (NP) into the metal are both effective methods. Au-Cu alloys can be prepared by alloying electrodeposition, and a Au-Cu alloy micro-pillar with a square cross-section of 10 µm × 10 µm and a height of 20 µm shows a high yield strength at 1.38 GPa. Introducing TiO2 NPs into the electrodeposited gold is also conducted to enhance the mechanical strength. A micro-pillar fabricated from a Au-TiO2 composite film is showing a yield strength at 0.84 GPa.
In electrodeposition of metals, alloying and incorporation of oxide nanoparticles (NP) into the metal are both effective methods. Au-Cu alloys can be prepared by alloying electrodeposition, and a Au-Cu alloy micro-pillar with a square cross-section of 10 µm × 10 µm and a height of 20 µm shows a high yield strength at 1.38 GPa. Introducing TiO2 NPs into the electrodeposited gold is also conducted to enhance the mechanical strength. A micro-pillar fabricated from a Au-TiO2 composite film is showing a yield strength at 0.84 GPa.