2019年第80回応用物理学会秋季学術講演会

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一般セッション(口頭講演)

13 半導体 » 13.3 絶縁膜技術

[19p-E305-1~15] 13.3 絶縁膜技術

2019年9月19日(木) 13:45 〜 17:45 E305 (E305)

入沢 寿史(産総研)、小林 清輝(東海大)

14:45 〜 15:00

[19p-E305-5] Effect of Hydrogen Neutral Beam Treatment on Atomic layer deposition SiO2

HuaHsuan Chen1、Bei Bei Ge1、Susumu Toko1、Daisuke Ohori1、Takuya Ozaki1、Tomohiro Kubota2、Mitsuya Utsuno2、Toshihisa Nozawa2、Seiji Samukawa3 (1.IFS,Tohoku Univ.、2.ASM Japan K.K.、3.AIMR, Tohoku Univ.)

キーワード:atomic layer deposition, neutral beam, silicon dioxide

In this study, some results of a novel deposition technique, neutral beam enhanced atomic layer deposition (NBEALD), are presented. We used this novel technique which utilizes neutral beam technology in atomic layer deposition to deposit high-quality SiO2 layer using precursor Aminosilane and O2 neutral beam at low substrate temperature near room temperature (30℃). The results demonstrate typical ALD process and good thickness control at angstrom level. Film properties such as chemical composition, surface roughness, uniformity, electrical property and wet etch rate for different experiment conditions are compared and discussed in this study. In addition, we present a way to improve the film quality which uses the hydrogen neutral beam post-treatment after NBEALD deposition.