[19p-PB2-1~7] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[19p-PB2-3] Effects of magnetic field and stirring on neutral electroless copper plating

〇Atsuhiro Yamagishi¹, Reiji Tanabe¹, Osamu Sugiura¹ (1.Chiba inst. of Tech.)

Keywords:electroless copper plating, magnetic field