[19p-PB7-1~16] 12.1 Fabrications and Structure Controls

[19p-PB7-14] Development of silver nanoparticle ink for reverse offset printing and fabrication of high-resolution printed electrodes

〇(B)Taichi Kikkawa¹, Taiga Taniguchi², Yudai Henmi¹, Tomohito Sekine^2,3, Yasunori Takeda^2,3, Daisuke Kumaki^2,3, Shizuo Tokito^2,3 (1.Faculty of Engineering ,yamagata Univ., 2.Graduate School of Organic Materials Science,Yamagata Univ., 3.Research Center for Organic Electronics (ROEL),Yamagata Univ.)

Keywords:reverse offset printing, silver nanoparticle ink, fine pattern

Reverse offset printing can form fine electrodes of several μm order. Thus,it is suitable method for the integration of organic TFT circuits. On the other hand, since the printing process is a multi-step process in which coating and transfer are performed via a blanket, the required characteristics of the ink are also complicated. Knowledge about the suitable properties for the ink is insufficiently. In this study, we report the ink formulation method for reverse offset printing.