2019年第80回応用物理学会秋季学術講演会

講演情報

一般セッション(口頭講演)

合同セッションK「ワイドギャップ酸化物半導体材料・デバイス」 » 21.1 合同セッションK 「ワイドギャップ酸化物半導体材料・デバイス」

[20a-B31-1~12] 21.1 合同セッションK 「ワイドギャップ酸化物半導体材料・デバイス」

2019年9月20日(金) 09:00 〜 12:15 B31 (B31)

浦岡 行治(奈良先端大)、井手 啓介(東工大)

11:30 〜 11:45

[20a-B31-10] Effect of Solution Processed High-k Hybrid Gate Insulator Film Curing Temperature on Amorphous In-Ga-Zn-O Thin-Film Transistors Performance

Ployrung Kesorn1、Juan Paolo Bermundo1、Naofumi Yoshida2、Toshiaki Nonaka2、Mami N. Fujii1、Yasuaki Ishikawa1、Yukiharu Uraoka1 (1.Nara Institute of Science and Technology、2.Merck Performance Material Ltd.)

キーワード:high performance IGZO TFTs, hybrid gate insulator material, high-k gate insulator

To fabricate high performance amorphous In-Ga-Zn-O thin-film transistors (a-IGZO TFTs) for flexible display applications, low temperature process is required. Moreover, using high-k material to replace conventional SiO2 gate insulators in a-IGZO TFTs has been widely studied due to limitation in miniaturization and dielectric property. Therefore, organic-inorganic hybrid material can be a way to enable curing in lower process temperatures. In this study, high-k BaTiO3 nanoparticles and flexible transparent Poly-siloxane (Poly-SX) composition was used to deposit solution processed gate insulator. This research shows performances of solution processed hybrid gate insulated a-IGZO TFTs with at different film curing temperature of 180ºC, 300ºC and 500ºC. All TFTs exhibit switching behavior for all curing temperature conditions.