Zexin Wan

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Speaker, Author, Co-Author

Mon. Mar 11, 2019 1:30 PM - 3:30 PM PB3 (PB)

Poster presentation
| 13 Semiconductors
| 13.7 Compound and power electron devices and process technology

[11p-PB3-1~27] 13.7 Compound and power electron devices and process technology

1:30 PM - 3:30 PM

[11p-PB3-23] Analysis of SiC/Si bonding interface with thermal annealing treatment by XPS

〇Zexin Wan¹, Jianbo Liang¹, Naoteru Shigekawa¹ (1.Osaka City Univ.)