Jianbo Liang

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Speaker, Author, Co-Author

Tue. Mar 12, 2019 9:00 AM - 11:30 AM M121 (H121)

Oral presentation
| 13 Semiconductors
| 13.7 Compound and power electron devices and process technology

[12a-M121-1~9] 13.7 Compound and power electron devices and process technology

11:00 AM - 11:15 AM

[12a-M121-8] Formation of Diamond/Cu direct bonding for power device application

〇Jianbo Liang¹, Shinji Kanda¹, Satoshi Masuya², Makoto Kasu², Naoteru Shigekawa¹ (1.Osaka City Univ., 2.Saga Univ.)