[10a-S321-1~13] 1.3 Novel technologies and interdisciplinary engineering

[10a-S321-4] Development of a pattern collapse-free drying process after wet cleaning by rapid drying technology

〇Jun Matsushita¹, Yuji Nagashima¹, Kounosuke Hayashi¹, Kiyokazu Nagahara¹, Kunihiro Miyazaki¹ (1.Shibaura Mechatronics)

Keywords:semiconductor, Drying, Pattern collapse

In recently, development of drying techniques such as surface modification drying, supercritical drying and the like has been widely developed. On the other hand, We have been developing technique which dries without generating surface tension between patterns to suppress pattern collapse by vaporizing only pattern surface liquid layer by using wafer heating. At the day, We report that rapid drying technique is higher effective as a technique to suppress pattern collapse than IPA drying.