2019年第66回応用物理学会春季学術講演会

講演情報

一般セッション(口頭講演)

13 半導体 » 13.3 絶縁膜技術

[11p-M136-1~14] 13.3 絶縁膜技術

2019年3月11日(月) 13:15 〜 17:15 M136 (H136)

渡邉 孝信(早大)、喜多 浩之(東大)、小林 清輝(東海大)

13:30 〜 13:45

[11p-M136-2] High quality silicon dioxide by low temperature neutral beam enhanced atomic layer deposition

HuaHsuan Chen1、Daisuke Ohori1、Takuya Ozaki1、Mitsuya Utsuno2、Tomohiro Kubota2、Toshihisa Nozawa2、Seiji Samukawa1,3 (1.IFS, Tohoku Univ.、2.ASM Japan K.K.、3.AIMR, Tohoku Univ.)

キーワード:atomic layer deposition, neutral beam enhancement, silicon dioxide

Conventional atomic layer deposition techniques have shown good thin-layer conformality. However, they have some limitations. In this study, some results of a novel deposition technique, neutral beam enhanced atomic layer deposition (NBEALD), are presented. We used this hybrid technique which utilizes neutral beam technology in atomic layer deposition process to deposit SiO2 layer using Aminosilane and O2 neutral beam at low substrate temperature near room temperature. The results demonstrate typical ALD process and good thickness control at nanometer level. Film properties such as chemical composition, surface roughness, uniformity and wet etch rate are also shown in this study.