The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.9 Compound solar cells

[11p-W321-1~14] 13.9 Compound solar cells

Mon. Mar 11, 2019 1:45 PM - 5:30 PM W321 (W321)

Kentaroh Watanabe(Univ. of Tokyo), Yasushi Shoji(AIST)

3:30 PM - 3:45 PM

[11p-W321-7] Wavelength-conversion material-mediated semiconductor wafer bonding

Kodai Kishibe1, Soichiro Hirata1, Katsuaki Tanabe1 (1.Kyoto Univ.)

Keywords:Wavelength-conversion, wafer bonding, multijunction solar cell

Wavelength-conversion material-mediated semiconductor wafer bonding has been demonstrated by utilizing an adhesive and viscous organic matrix embedding fluorescent particles. This scheme is expected to enhance solar cell efficiency and structure flexibility by photon management and current matching among subcells, and light source and detector performance in hybrid photonic integrated circuits by the delivery of preferred frequencies to each of gain/absorber and waveguide materials.