The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

13 Semiconductors » 13.9 Compound solar cells

[11p-W321-1~14] 13.9 Compound solar cells

Mon. Mar 11, 2019 1:45 PM - 5:30 PM W321 (W321)

Kentaroh Watanabe(Univ. of Tokyo), Yasushi Shoji(AIST)

3:45 PM - 4:00 PM

[11p-W321-8] Hydrogel-mediated semiconductor wafer bonding

Kodai Kishibe1, Katsuaki Tanabe1 (1.Kyoto Univ.)

Keywords:wafer bonding, hydrogel, multijunction solar cell

Hydrogel-mediated semiconductor wafer bonding has been demonstrated for low-cost fabrication of high-efficiency lattice-mismatched multijunction solar cells. Wafer direct bonding cannot be applied when wafers have roughness or in the presence of particles. This bonding scheme benefits from high surface roughness and particulate tolerances, optical transmittance, and electrical conductivity by utilizing an adhesive and viscous hydrogel. We have compared three types of hydrogels and each of them had sufficient transmittance, bonding strength, and conductivity for the fabrication of high-efficiency multijunction solar cells.