The 66th JSAP Spring Meeting, 2019

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Poster presentation

3 Optics and Photonics » 3.15 Silicon photonics

[9a-PB2-1~9] 3.15 Silicon photonics

Sat. Mar 9, 2019 9:30 AM - 11:30 AM PB2 (PB)

9:30 AM - 11:30 AM

[9a-PB2-8] bonding of InP-based laser diode on Si platform using polymer intermediate layer

〇Yuki Kinoshita1, Ryousuke Morita1, Kana Shimizu1, Yuichi Matsusima2, Hirosi Ishikawa1, Katsuyuki Utaka1 (1.waseda univ., 2.GCS,waseda univ.)

Keywords:bonding