The 66th JSAP Spring Meeting, 2019

Presentation information

Poster presentation

12 Organic Molecules and Bioelectronics » 12.1 Fabrications and Structure Controls

[9p-PB3-1~28] 12.1 Fabrications and Structure Controls

Sat. Mar 9, 2019 4:00 PM - 6:00 PM PB3 (PB)

4:00 PM - 6:00 PM

[9p-PB3-28] Bonding of PEDOT: PSS films using thermocompression.

Kazuki Maeda1, Masashi Nitani1, Mayumi Uno1 (1.ORIST)

Keywords:Conductive polymers, UV treatment, Flexible electronics

For practical applications of flexible devices, it is crucial to advance not only the technology of flexible discrete components but flexible electronic packaging technology. Therefore, it is strongly required for bonding technique using soft materials. As a bonding technique of polymer materials, it is known that PMMA materials adhere each other by thermocompression at under Tg after surface treatments using ultraviolet photo irradiations. However, bonding of conductive polymers has not yet been studied. In this study, we present the electric bonding method using thermocompression of PEDOT:PSS films.
PEDOT:PSS films were bonded using thermocompression after treatments of UV photo irradiations, and were investigated their bonding strength and the conductivity. As a result, it was revealed that the bonding strength of the conductive polymer wiring was improved by UV photo irradiation. It was also found that the bonded conductive polymer wiring shows ohmic electrical characteristics. In the presentation, we will also report the change of the surface condition before and after UV irradiation measured by XPS analysis.