The 66th JSAP Spring Meeting, 2019

Presentation information

Oral presentation

7 Beam Technology and Nanofabrication » 7.3 Micro/Nano patterning and fabrication

[9p-S223-1~12] 7.3 Micro/Nano patterning and fabrication

Sat. Mar 9, 2019 1:45 PM - 5:00 PM S223 (S223)

Jiro Yamamoto(HITACHI), Jun Taniguchi(Tokyo Univ. of Sci.)

4:45 PM - 5:00 PM

[9p-S223-12] Mask Fabrication for Quartz Glass Deep Etching by use of Electroless Ni Plating

Ryuichirou Oohoto1, 〇Hiroaki Kawata1, Masaaki Yasuda1, Yoshihiko Hirai1 (1.Osaka Pre Univ.)

Keywords:etching mask, electrodeless Ni plating, deep etching

Since the mask etching selectivity for a quartz plasma etching is often small, it is difficult to obtain quartz deep etching. Since a nickel is hardly etched by conventional etching conditions, Ni mask is suitable for quartz deep etching. In this report, Ni etching mask is fabricated by electroless Ni plating where no vacuum process is required. Two processes where Ni mask pattern is same as the resist pattern (posi process) and Ni mask pattern is reverse to the resist pattern (nega process) are developed.