[11p-Z04-1~14] 13.7 Compound and power electron devices and process technology

△ [11p-Z04-8] Wafer Warpage Prediction of Si Trench MOSFET using Multi-Scale Stress Analysis

〇Kazuyuki Ito¹, Tatsuhiro Oda¹, Takuo Kikuchi¹, Yoshiyuki Kitahara¹, Hidehiko Yabuhara¹, Toshifumi Nishiguchi², Hiroaki Katou², Saya Shimomura², Tatsuya Nishiwaki² (1.Toshiba, 2.Toshiba Electronic Devices & Storage)

Keywords:Power semiconductors, MOSFET, Warpage