The 67th JSAP Spring Meeting 2020

Presentation information

Oral presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[12p-A305-1~13] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Thu. Mar 12, 2020 1:45 PM - 5:15 PM A305 (6-305)

Munehiro Tada(NEC), Marina Yamaguchi(Kioxia)

3:30 PM - 3:45 PM

[12p-A305-7] Large-Scale Evaluation of MIM Devices Using High-Precision Current Measurement Array Test Circuit

Hayato Suzuki1, Hyeonwoo Park1, Akinobu Teramoto2,3, Rihito Kuroda1,3, Tomoyuki Suwa3, Shigetoshi Sugawa1,3 (1.Grad. Sch. Eng., Tohoku Univ., 2.Res. Inst. for Nanodevice and Bio Systems, Hiroshima Univ., 3.NICHe, Tohoku Univ.)

Keywords:low current measurement, metal-insulator-metal device, test element group

We developed a large-scale evaluation technology for MIM (Metal-Insulator-Metal) devices using a high-precision current measurement array test circuit. The fabrication process consists of a common platform process and additional MIM formation process in order to fabricate and evaluate various MIM devices.