The 67th JSAP Spring Meeting 2020

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[12p-B401-1~16] 13.7 Compound and power electron devices and process technology

Thu. Mar 12, 2020 1:15 PM - 5:30 PM B401 (2-401)

Masashi Kato(Nagoya Inst. of Tech.)

3:30 PM - 3:45 PM

[12p-B401-9] Self-aligned contact formation by continuous growth of n+-GaN and metal

Nao Ogasawara1, Masahiro Yoshimoto1, 〇Kazuki Kodama2, Daisuke Ueda2 (1.Kyoto Inst. of Tech., 2.Nagoya Univ.)

Keywords:pico-second laser PLD, Self-aligned process, GaN

GaN power devices has been extensively studied as low-loss and high-voltage power conversion devices. In particular, it is expected that a decrease in contact resistance strongly reduces on-resistance for middle and low voltage GaN power devices. So far, we reported high-concentration n+-GaN regrowth (4×1020 cm-3) enables to form non-alloy ohmic electrodes by using picosecond laser PLD method. In this work, we studied self-aligned contact formation by continuous growth of n+-GaN and metal. The process without mask-alignment was developed using Lift-off process with Si/SiO2 insulators.