The 67th JSAP Spring Meeting 2020

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[13p-PA9-1~25] 13.7 Compound and power electron devices and process technology

Fri. Mar 13, 2020 4:00 PM - 6:00 PM PA9 (PA)

4:00 PM - 6:00 PM

[13p-PA9-23] Performance Improvement of Superjunction IGBT by Three-Dimensional Scaling

Hajime Kayashima1, Munetoshi Hukui1, Kiyoshi Takeuchi1, Masaharu Kobayashi1,2, Toshiro Hiramoto1 (1.IIS, Univ. of Tokyo, 2.d.lab, Univ of Tokyo)

Keywords:IGBT, Superjunction, scaling

IGBT in which superjunction structure is introduced into the drift layer is called superjunction IGBT, and its turn-off loss is significantly lower than a conventional IGBT. In this research, it is shown that the performance is further improved by applying the scaling rule as used in CMOS, to the emitter structure of the superjunction IGBT.