The 67th JSAP Spring Meeting 2020

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[14p-B401-1~17] 13.7 Compound and power electron devices and process technology

Sat. Mar 14, 2020 1:30 PM - 6:15 PM B401 (2-401)

Tetsuya Suemitsu(Tohoku Univ.), Taketomo Sato(Hokkaido Univ.)

5:30 PM - 5:45 PM

[14p-B401-15] Insulating Ga2O3 layer formation at SiO2/β-Ga2O3 interface during oxygen annealing at 1000℃ and its impact on Ga2O3 MOS interface characteristics

〇(M2)QIN MAO1, Koji KITA1 (1.Tokyo Univ.)

Keywords:Ga2O3, O2 annealing, Lower concentration region

We observed increase in effective dielectric layer thickness of Au/SiO2/β-Ga2O3(001) MOS capacitors after O2 PDA at 1000℃, from capacitance-voltage measurements. However, the SiO2 thickness measured by x-ray reflectivity remained the same. This could be explained by the assumption that surface region of Ga2O3 becomes insulating due to O2 annealing. Besides, a lower carrier concentration region was formed near SiO2/β-Ga2O3 interface.