The 67th JSAP Spring Meeting 2020

Presentation information

Oral presentation

13 Semiconductors » 13.7 Compound and power electron devices and process technology

[14p-B401-1~17] 13.7 Compound and power electron devices and process technology

Sat. Mar 14, 2020 1:30 PM - 6:15 PM B401 (2-401)

Tetsuya Suemitsu(Tohoku Univ.), Taketomo Sato(Hokkaido Univ.)

3:45 PM - 4:00 PM

[14p-B401-9] Carrier transport characteristics depending on AlN spacer layer thickness on InAlN/GaN heterostructure

Yasuki Kimura1, Takuya Hoshii1, Kiyotaka Miyano2, Shinya Nunoue3, Hajime Nago3, Ichiro Mizushima1,2, Takashi Yoda1,2, Kuniyuki Kakushima1, Hitoshi Wakabayashi1, Kazuo Tsutsui1 (1.Tokyo Tech., 2.NuFlare Technology Inc., 3.Toshiba Corp.)

Keywords:InAlN/GaN, AlN spacer layer, 2DEG