Genki Sawada

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Speaker, Author, Co-Author

Sun. Sep 12, 2021 1:30 PM - 5:15 PM N304 (Oral)

Oral presentation
| 13 Semiconductors
| 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[12p-N304-1~14] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

4:15 PM - 4:30 PM

△ [12p-N304-11] Study of TiN as barrier metal for W via on Cu interconnect

〇Genki Sawada¹, Masayuki Kitamura¹, Atsushi Kato¹, Hiroaki Matsuda¹, Koji Arita¹, Masayoshi Tagami¹, Yumi Nakajima¹, Atsushi Oga¹ (1.KIOXIA Corporation)

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