[16p-P13-1~2] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[16p-P13-2] A Study on the Suspension Structures of In-Plane Vibrational Au-MEMS Devices

〇(B)Kohei Hayama¹, Kosuke Kawashima¹, Muneoki Sawada¹, Kentarou Tamura¹, Daisuke Yamane^1,2 (1.Ritsumeikan Univ., 2.JST PRESTO)

Keywords:MEMS, spring, Au

We report a study on the suspension structures of in-plane vibrational Au-MEMS devices. Analytical models are used to evaluate suspension structures made by a thick-film Au electroplating. It is found that the folded-flexure spring is more useful for in-plane vibrational MEMS devices than the serpentine spring when the Au thickness increases up to 30 μm.