The 68th JSAP Spring Meeting 2021

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[19p-Z24-1~10] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Fri. Mar 19, 2021 1:30 PM - 4:15 PM Z24 (Z24)

Kuniyuki Kakushima(Tokyo Tech), Masato Sone(Tokyo Tech)

2:00 PM - 2:15 PM

[19p-Z24-3] Si Three-Dimensional Structure Annealing In a Hydrogen Atmosphere Using a Minimal Laser Heating Tool

kazushige sato1,4, Takashi Chiba1,4, Masao Terada1,4, Kengo Hamada1,4, Yoshiyuki Nakayama3, Yoshiaki Kanamori3, Hiroyuki Tanaka2, Masashi Kase2, Sommawan Khumpuang1,2, Shiro Hara1,2 (1.MINIMAL, 2.AIST, 3.Tohoku Univ., 4.Sakaguchi E.H VOC Corp.)

Keywords:Minimal Fab, Laser Heating

MEMSデバイスの基本構造であるカンチレバー構造を試作し、その立体構造に対して開発中のミニマルレーザ水素アニール装置を用い表面処理を実施し、その効果を調べた。