The 83rd JSAP Autumn Meeting 2022

Presentation information

Poster presentation

13 Semiconductors » 13.7 Compound and power devices, process technology and characterization

[20p-P04-1~21] 13.7 Compound and power devices, process technology and characterization

Tue. Sep 20, 2022 4:00 PM - 6:00 PM P04 (Arena)

4:00 PM - 6:00 PM

[20p-P04-1] Operating of 4H-SiC CMOS UV image sensor pixel device at 200°C high temperature

Masayuki Tsutsumi1, Tatsuya Meguro1, Akinori Takeyama2, Takeshi Ohshima2, Yasunori Tanaka3, Shin-Ichiro Kuroki1 (1.RIND, Hiroshima Univ., 2.QST, 3.AIST)

Keywords:Silicon Carbide, CMOS Image Sensor, UV Photodiode

Harsh environment electronics are expected to be used in a variety of areas, such as high temperature, high radiation, and other harsh environments. SiC, a wide bandgap semiconductor, is expected to have excellent high temperature resistance. In this study, the pixel part of a CMOS image sensor was fabricated using 4H-SiC, and high temperature operation experiments up to 200°C were conducted.