[21a-C105-1~12] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[21a-C105-11] Metal pattern formed by selective neutral copper plating on polyimide film

〇Yudai Hirano¹, Sugiura Osamu¹ (1.Chiba Inst of Tech.)

Keywords:neutral copper plating, Sensitizing-Activation, Integrated circuit

In this study, a photochemical reaction is used to generate a catalyst nucleus at a site irradiated with light, and selective neutral electroless copper plating is applied. We are studying copper chloride as a photosensitive material, and generate catalyst nuclei for neutral electroless copper plating by irradiating copper chloride with laser light. If it can be confirmed that the laser-irradiated part is copper-plated, it is possible to manufacture a printed circuit board that does not require a resist.