[21a-C105-1~12] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

△ [21a-C105-8] Electromigration in the intermetallic compound CuAl₂

〇Toshihiro Kuge^1,2, Yahagi Masataka^1,2, Koike Junichi¹ (1.Tohoku Univ., 2.JX Nippon Mining & Metals Corp.)

Keywords:semiconductor, electromigration, interconnects