The 83rd JSAP Autumn Meeting 2022

Presentation information

Oral presentation

13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[21a-C105-1~12] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Wed. Sep 21, 2022 9:00 AM - 12:15 PM C105 (C105)

Kentaro Kinoshita(Tokyo Univ. of Sci.), Satoshi Yamauchi(茨大)

11:15 AM - 11:30 AM

[21a-C105-9] Formation and Evaluation of Ru Films for Fine Interconnect Application by Electroless Plating

Saida Ryota1, Tomohiro Shimizu1, Takeshi Ito1, Shoso Shingubara1 (1.Kansai Univ.)

Keywords:electroless Plating