[21a-C105-1~12] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[21a-C105-9] Formation and Evaluation of Ru Films for Fine Interconnect Application by Electroless Plating

〇Saida Ryota¹, Tomohiro Shimizu¹, Takeshi Ito¹, Shoso Shingubara¹ (1.Kansai Univ.)

Keywords:electroless Plating