[24a-E103-1~13] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[24a-E103-5] Study of interval time effect to exchange gases in Bosch Process

〇Hiroyuki Tanaka¹, Sang-Seok Lee², Yoshiyuki Nozawa³, Toshihiro Hayami³, Sommawan Khumpuang^1,4, Shiro Hara^1,4 (1.AIST, 2.Tottori Univ., 3.SPPT, 4.MINIMAL)

Keywords:Bosch, minimal, Deep RIE

In order to perform vertical deep etching in the Bosch process, it is important to keep the balance between passivation and etching. It is desirable that each of these is performed reliably. Therefore, we set an interval between the passivation and the etching process and set up steps so that each process could be performed more steadily, then, a large difference occurred in the etching shape even if the interval time was slightly changed. We report the analysis of these etching mechanisms.