The 69th JSAP Spring Meeting 2022

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13 Semiconductors » 13.5 Semiconductor devices/ Interconnect/ Integration technologies

[25p-E307-1~15] 13.5 Semiconductor devices/ Interconnect/ Integration technologies

Fri. Mar 25, 2022 1:30 PM - 5:30 PM E307 (E307)

Takeshi Momose(Univ. of Tokyo), Osamu Sugiura(千葉工大)

4:15 PM - 4:30 PM

[25p-E307-11] Low-temperature deposition of SiO2 TSV liner by using HMDS-CVD

〇Bungo Tanaka1, Aoba Onishi2, Ryotaro Bamba1, Hisashi Kino2, Takafumi Fukushima2,3, Tetsu Tanaka2,3 (1.School of Engineering, Tohoku Univ., 2.Graduate School of Biomedical Engineering, Tohoku Univ., 3.Graduate School of Engineering, Tohoku Univ.)

Keywords:semiconductor, artificial retina, oxide film