[26p-E206-1~14] CS.6 Code-sharing Session of 6.5 & 7.6

[26p-E206-12] Characterization of small vacuum process vessels made of 0.2%Be-Cu material

〇Takao Nakamura¹, Masahide Kuroiwa², Shinsuke Kishikawa², Shuichi Hemmi², Ryuichiro Kamei³ (1.The Univ. of Tokyo, 2.Tokyo Electronics, 3.Seinan Industry)

Keywords:Be-Cu, Vacuum vessel

0.2% Be-Cu material (BeCu) has excellent characteristics such as 13 times higher heat conduction than SUS, low heat radiation of 1/7 or less, and low degassing, and is applied to vacuum gauges in ultra-high vacuum systems. In recent years, the National Institute of Advanced Industrial Science and Technology has developed a semiconductor high-mix low-volume production scheme, that is, minimal fab. system using 1/2 "wafers. In the minimal fab system, small vacuum vessels were used. However, the ratio of the wafer surface area to the vacuum vessel surface area increases compared to the large equipment, and the vacuum vessel innner surface quality inevitably has a greater effect on the process (about 30 times). We applied the vacuum process vessel made of BeCu for the minimal equipment. The characteristics required for the process vessel such as the degree of vacuum, degassing and temperature uniformity are compared between SUS and BeCu. We quantitatively clarified the superiority of BeCu.