1:15 PM - 1:30 PM
[15p-A408-2] Chemical bonding evaluation of DLC films using HiPIMS and high frequency HiPIMS methods
〇(DC)Hiroyuki Fukue1, Tatsuyuki Nakatani1, Tadayuki Okano2, Masahide Kuroiwa2, Shinsuke Kunitsugu3, Susumu Takabayashi4, Hiroki Oota5, Ken Yonezawa5,1 (1.Okayama Univ. of Sci., 2.Tokyo Electronics Co., Ltd., 3.Ind. Technol. Cent. Okayama Pref., 4.National Inst. Technol., Ariake College, 5.Kenix Corporation)