Keiko Koshiba

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Speaker, Author, Co-Author

Thu. Mar 16, 2023 1:30 PM - 3:30 PM PA04 (Poster)

Poster presentation
| 13 Semiconductors
| 13.7 Compound and power devices, process technology and characterization

[16p-PA04-1~24] 13.7 Compound and power devices, process technology and characterization

1:30 PM - 3:30 PM

[16p-PA04-23] Stress-relieving Interconnection for Power Device Packaging using Fe-Ni Alloy Electroplating with Low Thermal Expansion

〇Keiko Koshiba^1,2, Kohei Tatsumi^1,2 (1.Waseda Univ. IPS, 2.Waseda Univ. IPS Research Center)