The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[15p-B410-1~15] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Wed. Mar 15, 2023 1:00 PM - 5:30 PM B410 (Building No. 2)

Masato Sone(Tokyo Tech), Fumito Imura(Hundred Semiconductors Inc.)

5:15 PM - 5:30 PM

[15p-B410-15] Piezoelectric Valve Micropump Using UV Laser-Patterned Adhesive Sheet

Yuki Okamoto1, Yasuyuki Yamamoto1, Tomoya Muramoto1, Masaaki Ichiki1, Takeshi Kobayashi1 (1.AIST)

Keywords:MEMS, Piezoelectric thin-film actuator, micropump

Valve micropumps are widely used because of the large pressure output and flow rates. In the typical fabrication of micropumps, the processes are complicated for forming the valve structures. In this study, we report a piezoelectric valve micropump using UV laser-patterned adhesive sheet, enabling us to utilize standard MEMS processes.