1:30 PM - 3:30 PM
[15p-PB03-7] Control of Cu film structure prepared by dual bipolar HPPMS
Keywords:Sputtering, Ionized PVD
We proposed a system equipped with two cathodes to increase the plasma potential during the high-power pulsed magnetron sputtering discharge. Each cathode was driven by bipolar pulse voltages shifted by half-period. Copper films were deposited, and the film structure modification by the positive voltage was demonstrated.