The 70th JSAP Spring Meeting 2023

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si processing /Si based thin film / MEMS / Equipment technology

[16a-B410-1~9] 13.4 Si processing /Si based thin film / MEMS / Equipment technology

Thu. Mar 16, 2023 9:00 AM - 11:30 AM B410 (Building No. 2)

Masato Sone(Tokyo Tech), Reo Kometani(Univ. of Tokyo)

9:30 AM - 9:45 AM

[16a-B410-3] Influence of Cross-sectional Area of Gold Single Crystal Micro-cantilevers on Their Bending Strengths

〇(M1)Ryohei Hori1, Kazuya Fujita1, Chun-Yi Chen1, Tomoyuki Kurioka1, Tso-Fu Mark Chang1, Parthojit Chakraborty1, Katsuyuki Machida1, Hiroyuki Ito1, Yoshihiro Miyake1, Masato Sone1 (1.Tokyo Tech)

Keywords:size effect, cross-sectional area, bending

The use of Au is proposed in order to increase MEMS accelerometer sensitivity. However, when Au material is used, the mechanical strength is a practical problem. Also, when metallic material is used in micro-scale, it’s necessary to consider sample size effect that the mechanical strength increases compared to bulk-scale. So, evaluating mechanical properties of Au material in micro-scale is important. This research reports influence of the cross-sectional area on the bending deformation of single crystal Au micro-cantilevers.