[16a-E302-1~6] 【Open Symposium】Connection : From BEOL to Tiplet, and to the Future **In corporation with The Japan Institute of Electronics
Packaging (JIEP)

[16a-E302-1] Evolution and Recent Trends of BEOL Technology

〇Kazuyoshi Ueno¹ (1.Shibaura Inst. Tech.)

Keywords:interconnect, copper, alternative metals

In multi-level interconnects used in integrated circuits, miniaturization by scaling and multi-layering have progressed in order to improve the degree of integration. At present, Cu/low-k interconnect is used for multi-level interconnects, but as the interconnect size approaches the nanoscale, problems such as an increase in resistance due to electron scattering and a decrease in reliability arise again. In this presentation, I will explain the current Cu/low-k interconnect technology and issues, and discuss the recent developments in Cu alternative metals and Cu-extension technology, as well as buried power rails (BPR) and backside power delivery networks (BSPDN), and other recent research and development trends to solve these issues.